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Light Emitting Diode Led Tube Light Pcb Assembly Contract Manufacturer

Quanhong FASTPCB
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    Buy cheap Light Emitting Diode Led Tube Light Pcb Assembly Contract Manufacturer from wholesalers
     
    Buy cheap Light Emitting Diode Led Tube Light Pcb Assembly Contract Manufacturer from wholesalers
    • Buy cheap Light Emitting Diode Led Tube Light Pcb Assembly Contract Manufacturer from wholesalers
    • Buy cheap Light Emitting Diode Led Tube Light Pcb Assembly Contract Manufacturer from wholesalers
    • Buy cheap Light Emitting Diode Led Tube Light Pcb Assembly Contract Manufacturer from wholesalers

    Light Emitting Diode Led Tube Light Pcb Assembly Contract Manufacturer

    Ask Lasest Price
    Brand Name : FASTPCB
    Price : USD 0.01-100/PCS
    Supply Ability : 10PCS+48Hour
    • Product Details
    • Company Profile

    Light Emitting Diode Led Tube Light Pcb Assembly Contract Manufacturer

    At present, LED display screens have been widely used in sports venues, squares, conferences and even streets and shopping malls. The NASDAQ full color screen in Times Square is the most famous. The screen covers an area of 120 feet ×90 feet, equivalent to 1005m, and is made of 19 million ultra-bright blue, green and red LEDS. In addition, in the securities market screen, bank exchange rate screen, interest rate screen and other aspects of the application also accounted for a large proportion, in the recent expressway, viaduct information screen also has a great development. The application of led in this field has become a large scale, forming a new industry, and can be expected to have a relatively stable growth.


    HLC Process capability

    ItemHLC Advanced Technology
    201920202021
    Max Panel Width (inch)252525
    Max Panel Length (inch)292929
    Max Layer Count (L)161836
    Max Board thickness (mm)3.246
    Max Board thickness Tolerance+/-10%+/-10%+/-10%
    Base copper ThicknessInner layer ( OZ )468
    Outer Layer ( OZ )234
    Min DHS ( mm )0.20.150.15
    PTH Size Tolerance ( mil )+/-2+/-2+/-2
    Back Drill (stub)( mil )~ 3~ 2.4~ 2
    Max. AR12:116:120:1
    ItemHLC Advanced Technology
    201920202021
    M-drill toleranceInner layer ( mil )DHS + 10DHS + 10DHS + 8
    Outer Layer ( mil )DHS + 8DHS + 8DHS + 6
    Solder mask Registration (um)+/- 40+/- 30+/- 25
    Impedance control≥50ohms+/-10%+/-10%-/-8%
    <50ohms5 Ω5 Ω4 Ω
    Min LW/S (Inner)@1oz base Cu ( mil )3.0 / 3.02.6 / 2.62.5 / 2.5
    Min LW/S (Outer)@1oz Cu ( mil )3.5 / 3.53.0 / 3.53.0 / 3.0
    Max dimple for POFV ( um )302015
    Surface FinishingENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

    HDI Process capability

    ItemHDI Advanced Technology
    201920202021
    Structure5+n+56+n+67+n+7
    HDI Stack ViaAnyLayer(12L)AnyLayer(14L)AnyLayer(16L)
    Board Thickness(mm)Min. 8L0.450.40.35
    Min. 10L0.550.450.4
    Min. 12L0.650.60.55
    MAX.2.4
    Min. Core Thickness ( um )504040
    Min. PP Thickness ( um )30(#1027PP)25(#1017PP)20(#1010PP)
    Base Copper ThicknessInner Layer ( OZ)1/3 ~ 21/3 ~ 21/3 ~ 2
    Outer Layer ( OZ )1/3 ~ 11/3 ~ 11/3 ~ 1
    ItemHDI Advanced Technology
    201920202021
    Min. Mechanical Drill hole size(um) **200200150
    Max. Through Hole Aspect Ratio *8:110:110:1
    Min. Laser via/Pad Size ( um )75/20070/17060/150
    Max. Laser Via Aspect Ratio0.8:10.8:10.8:1
    Laser Via on PTH(VOP)designYesYesYes
    Laser X type through hole(DT≤200um)NA60~100um60~100um
    Min. LW/S (L/S/Cu, um)Inner Layer45 /45 /1540/ 40/ 1530/ 30 /15
    outer Layer50 /50/ 2040 /50 /2040 /40 /17
    Min BGA Pitch (mm)0.350.30.3
    ItemHDI Advanced Technology
    201920202021
    Solder mask Registration (um)+/- 30+/- 25+/- 20
    Min. Solder Mask Dam (mm)0.070.060.05
    PCB Warpage Control>= 50ohm+/-10%+/-8%+/- 5%
    < 50ohm+/- 5ohm+/- 3ohm+/- 3ohm
    PCB Warpage Control≤0.5%≤0.5%≤0.5%
    cavity Depth accuracy (um)Mechanical+/- 75+/- 75+/- 50
    Laser directly+/- 50+/- 50+/- 50
    Surface FinishingOSP,ENIG,Immersion Tin,Hard Au, Immersion AgOSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

    SMT Capability

    ItemSMT Capability
    201920202021
    Min board thickness ( mm )0.10.060.05
    Max. board size ( mm )200 x 250250 x 300250 x 350
    Chip component ( L, C, R etc. )Minimum size100510051005
    Connector0.5 mm pitchYYY
    0.4 mm pitchYYY
    0.35 mm pitchYYY
    High density component :0.5 mm pitchYYY
    TSOP, QFP, QFN, LGA, BGA etc.0.4 mm pitchYYY
    0.35 mm pitchYYY
    ReflowN2 reflowNoYY
    Under-fillFill under chipManualAutoAuto
    ACF attachGold finger pitchN/A0.3 mm0.2 mm
    InspectionComponent position, direction, missing etc.Manual check with 10 x scopeAuto AOI inspectionAuto AOI inspection
    Solder paste thicknessMeasure once per shift1 line auto full area, online SPIAll lines auto full area, online SPI

    Packaging & Delivery
    Packaging Details:Inner: vacuum packing or Anti-static package,
    Outer: export carton
    or according to the customer's requirement.
    Port:Shenzhen or Hongkong
    Lead Time:Quantity(Pieces)1-1011-100101-1000>1000
    Est. Time(days)3-53-57-9To be negotiated

    FAQ:

    Q: What service do you have?
    FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.


    Q: What is needed for PCB & PCBA quotation?
    FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
    For PCB: PCB information, BOM,Testing documents.


    Q: How to keep our product information and design file secret ?
    FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.


    Q: What are the main products of your PCB/PCBA services?
    FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.


    Q: What is your minimum order quantity (MOQ)?
    FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.


    Q: Are you factory?

    FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

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