Sign In | Join Free | My himfr.com
Home > Special PCB >

High Density Pcb Multi Layer Printed Circuit Board 2.0mm

    Buy cheap High Density Pcb Multi Layer Printed Circuit Board 2.0mm from wholesalers
     
    Buy cheap High Density Pcb Multi Layer Printed Circuit Board 2.0mm from wholesalers
    • Buy cheap High Density Pcb Multi Layer Printed Circuit Board 2.0mm from wholesalers

    High Density Pcb Multi Layer Printed Circuit Board 2.0mm

    Ask Lasest Price
    Brand Name : FASTPCB
    Price : USD 0.01-100PCS
    Supply Ability : 10PCS+48Hour(production time )
    • Product Details
    • Company Profile

    High Density Pcb Multi Layer Printed Circuit Board 2.0mm

    High Density Multilayer Printed Circuit Board

    High Density Multilayer Printed Circuit Board is a special process printed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd., which is made of FR-4 material and surface gold deposition. The minimum line width and line spacing can reach 75 / 75um and the minimum aperture can reach 0.2mm. The circuit board is widely used in mobile phones, laptops, automobiles, tablet computers and other fields.

    HDI Advanced Technology

    ItemHDI Advanced Technology
    201920202021
    Structure5+n+56+n+67+n+7
    HDI Stack ViaAnyLayer(12L)AnyLayer(14L)AnyLayer(16L)
    Board Thickness(mm)Min. 8L0.450.40.35
    Min. 10L0.550.450.4
    Min. 12L0.650.60.55
    MAX.2.4
    Min. Core Thickness ( um )504040
    Min. PP Thickness ( um )30(#1027PP)25(#1017PP)20(#1010PP)
    Base Copper ThicknessInner Layer ( OZ)1/3 ~ 21/3 ~ 21/3 ~ 2
    Outer Layer ( OZ )1/3 ~ 11/3 ~ 11/3 ~ 1
    ItemHDI Advanced Technology
    201920202021
    Min. Mechanical Drill hole size(um) **200200150
    Max. Through Hole Aspect Ratio *8:110:110:1
    Min. Laser via/Pad Size ( um )75/20070/17060/150
    Max. Laser Via Aspect Ratio0.8:10.8:10.8:1
    Laser Via on PTH(VOP)designYesYesYes
    Laser X type through hole(DT≤200um)NA60~100um60~100um
    Min. LW/S (L/S/Cu, um)Inner Layer45 /45 /1540/ 40/ 1530/ 30 /15
    outer Layer50 /50/ 2040 /50 /2040 /40 /17
    Min BGA Pitch (mm)0.350.30.3
    ItemHDI Advanced Technology
    201920202021
    Solder mask Registration (um)+/- 30+/- 25+/- 20
    Min. Solder Mask Dam (mm)0.070.060.05
    PCB Warpage Control>= 50ohm+/-10%+/-8%+/- 5%
    < 50ohm+/- 5ohm+/- 3ohm+/- 3ohm
    PCB Warpage Control≤0.5%≤0.5%≤0.5%
    cavity Depth accuracy (um)Mechanical+/- 75+/- 75+/- 50
    Laser directly+/- 50+/- 50+/- 50
    Surface FinishingOSP,ENIG,Immersion Tin,Hard Au, Immersion AgOSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

    HLC Advanced Technology

    ItemHLC Advanced Technology
    201920202021
    Max Panel Width (inch)252525
    Max Panel Length (inch)292929
    Max Layer Count (L)161836
    Max Board thickness (mm)3.246
    Max Board thickness Tolerance+/-10%+/-10%+/-10%
    Base copper ThicknessInner layer ( OZ )468
    Outer Layer ( OZ )234
    Min DHS ( mm )0.20.150.15
    PTH Size Tolerance ( mil )+/-2+/-2+/-2
    Back Drill (stub)( mil )~ 3~ 2.4~ 2
    Max. AR12:116:120:1
    ItemHLC Advanced Technology
    201920202021
    M-drill toleranceInner layer ( mil )DHS + 10DHS + 10DHS + 8
    Outer Layer ( mil )DHS + 8DHS + 8DHS + 6
    Solder mask Registration (um)+/- 40+/- 30+/- 25
    Impedance control≥50ohms+/-10%+/-10%-/-8%
    <50ohms5 Ω5 Ω4 Ω
    Min LW/S (Inner)@1oz base Cu ( mil )3.0 / 3.02.6 / 2.62.5 / 2.5
    Min LW/S (Outer)@1oz Cu ( mil )3.5 / 3.53.0 / 3.53.0 / 3.0
    Max dimple for POFV ( um )302015
    Surface FinishingENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

    Packaging & Delivery
    Packaging Details:Inner: vacuum packing or Anti-static package,
    Outer: export carton
    or according to the customer's requirement.
    Port:Shenzhen or Hongkong
    Lead Time:Quantity(Pieces)1-1011-100101-1000>1000
    Est. Time(days)202125To be negotiated

    FAQ:

    Q: What service do you have?
    FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.


    Q: What is needed for PCB & PCBA quotation?
    FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
    For PCB: PCB information, BOM,Testing documents.


    Q: How to keep our product information and design file secret ?
    FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.


    Q: What are the main products of your PCB/PCBA services?
    FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.


    Q: What is your minimum order quantity (MOQ)?
    FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.


    Q: Are you factory?

    FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China


    Quality High Density Pcb Multi Layer Printed Circuit Board 2.0mm for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Quanhong FASTPCB
    *Subject:
    *Message:
    Characters Remaining: (0/3000)