| Sign In | Join Free | My himfr.com |
|
Professional medium and high-end samples, small and medium batch OEM PCB / PCBA manufacturers
4 Years
High Speed Electronic Circuit Board Manufacturers 20 Layer Impedance control
Anti-oxidation, high temperature resistance, waterproof
Anti-oxidation surface finish to ensure heat-shock resistance, moisture protec-tion to protect the surface from rusting and oxidation.
The 20 Layer High Speed Printed Circuit Board is a high-speed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. It is made by pure pressing of TU872LK high-speed materials, surface gold deposition and other production processes. It is widely used in the field of high-speed computers and high-end servers in cloud data centers. The products have the characteristics of stability and durability.
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Structure | 5+n+5 | 6+n+6 | 7+n+7 | |
HDI Stack Via | AnyLayer(12L) | AnyLayer(14L) | AnyLayer(16L) | |
Board Thickness(mm) | Min. 8L | 0.45 | 0.4 | 0.35 |
Min. 10L | 0.55 | 0.45 | 0.4 | |
Min. 12L | 0.65 | 0.6 | 0.55 | |
MAX. | 2.4 | |||
Min. Core Thickness ( um ) | 50 | 40 | 40 | |
Min. PP Thickness ( um ) | 30(#1027PP) | 25(#1017PP) | 20(#1010PP) | |
Base Copper Thickness | Inner Layer ( OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
Outer Layer ( OZ ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 | |
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Min. Mechanical Drill hole size(um) ** | 200 | 200 | 150 | |
Max. Through Hole Aspect Ratio * | 8:1 | 10:1 | 10:1 | |
Min. Laser via/Pad Size ( um ) | 75/200 | 70/170 | 60/150 | |
Max. Laser Via Aspect Ratio | 0.8:1 | 0.8:1 | 0.8:1 | |
Laser Via on PTH(VOP)design | Yes | Yes | Yes | |
Laser X type through hole(DT≤200um) | NA | 60~100um | 60~100um | |
Min. LW/S (L/S/Cu, um) | Inner Layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
outer Layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 | |
Min BGA Pitch (mm) | 0.35 | 0.3 | 0.3 | |
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Solder mask Registration (um) | +/- 30 | +/- 25 | +/- 20 | |
Min. Solder Mask Dam (mm) | 0.07 | 0.06 | 0.05 | |
PCB Warpage Control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
< 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm | |
PCB Warpage Control | ≤0.5% | ≤0.5% | ≤0.5% | |
cavity Depth accuracy (um) | Mechanical | +/- 75 | +/- 75 | +/- 50 |
Laser directly | +/- 50 | +/- 50 | +/- 50 | |
Surface Finishing | OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag | OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG | ||
Item | SMT Capability | |||
2019 | 2020 | 2021 | ||
Min board thickness ( mm ) | 0.1 | 0.06 | 0.05 | |
Max. board size ( mm ) | 200 x 250 | 250 x 300 | 250 x 350 | |
Chip component ( L, C, R etc. ) | Minimum size | 1005 | 1005 | 1005 |
Connector | 0.5 mm pitch | Y | Y | Y |
0.4 mm pitch | Y | Y | Y | |
0.35 mm pitch | Y | Y | Y | |
High density component : | 0.5 mm pitch | Y | Y | Y |
TSOP, QFP, QFN, LGA, BGA etc. | 0.4 mm pitch | Y | Y | Y |
0.35 mm pitch | Y | Y | Y | |
Reflow | N2 reflow | No | Y | Y |
Under-fill | Fill under chip | Manual | Auto | Auto |
ACF attach | Gold finger pitch | N/A | 0.3 mm | 0.2 mm |
Inspection | Component position, direction, missing etc. | Manual check with 10 x scope | Auto AOI inspection | Auto AOI inspection |
Solder paste thickness | Measure once per shift | 1 line auto full area, online SPI | All lines auto full area, online SPI | |
Packaging & Delivery | |||||
Packaging Details: | Inner: vacuum packing or Anti-static package, | ||||
Port: | Shenzhen or Hongkong | ||||
Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
Est. Time(days) | 3-5 | 3-5 | 7-9 | To be negotiated | |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication,
SMT, plastic injection & metal,final assembly, testing and other
value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic
requirements(material,size, surface finish treatment, copper
thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side
local law and promising tokeep customers data in high confidential
level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home,
Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can
support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing
Street, Bao 'an District, Shenzhen, Guangdong province, China
|
|
